DESMOPAN POLISHING DISCS

  • DESCRIPTION
    Desmopan is a polishing compound or slurry carrier of long-life durable plastic with ribbed surfaces for the polishing of Precision Optics. The pad is only available in a 123mm (4.84") disk, 0.50mm thick (0.020") with two patterns: Cubical or Lengthwise.
  • APPLICATION
    Cubic-Pressure 150gr/cm2 (2.1 sq. inches), Speed - 50 to 300 RPM.
    Lengthwise - Pressure 150-250 gr/cm2 (2.1 to 3.6 sq. inches) Speed 50 to 300 RPM.
  • RECOMMENDED POLISHING COMPOUND OR SLURRY
    High purity Cerium Oxide powder (Opaline), High Purity Cerium Oxide slurry.
  • PREPARING THE DESMOPAN PRIOR TO GLUING
    Cut in a star shape in segments or pieces. It is recommended that parallel linees be arranged in a radius if possible. Make small discs for BIG lenses and bid discss for SMALL lenses. Arrange the cut pieces in sections, if necessary, with an additional circle for large diameters (more than 200mm). The polishing tool should NEVER be completely sealed (no openings) with the Desmopan pad, even if the diameter of the tool makes it possible. Grind in the platen with either Microgrit WCA 30 or Silicon Carbide #320.
  • GLUING THE PAD TO THE PLATEN
    In order to have a good adhesion, the back of the Desmopan pad should be roughened prior to applying the adhesive. The first step is to apply a thin coat of Pattex contact adhesive to the platen AND the Desmopan pad using a fine-tooth spatula (saw blade). Allow the adhesive to dry for about 5 minutes. The next step is to apply the Desmopan pad to the platen. The final step: place a heavy flat plate on top of the Desmopan pad and let it dry for about 8 hours at room temperature. Note: the lines of the Desmopan must be either radial or vertical/horizontal.
  • NOTE: To cover a 300mm diameter platen, you need 20 whole pads and about 8 half pads. It is recommended that you reduce the size of the Desmopan to a 45mm diameter circle. One full size Desmopan can be cut into 4-45mm diameter pads. When gluing the cross-hatch design, the direction of the crosses is not important. If the straight-line pad is used, from pad to pad the line direction changes by 90 degrees.
  • CONDITIONING THE DESSMOPAD/ PLATEN - We recommend a tool with diamond pellets: D10 to D15 micron size. Use only water. Reason: this prevents contamination.
  • SECRET TO FLATNESS - The conditioning for Plano polishing should be done in such a way that the platen is slightly concave (1µ to 2µ) in the center deviating from absolute flatness to account for the pressure during polishing.

KC-SS-OH 2020 POROUS HARD PAD

"THE STAR OF THE SHOW"

~ CREATED, DEVELOPED, MANUFACTURED, INCLUDING THE INGREDIENTS AND MACHINERY TO PRODUCE THE MATERIAL, ALL IN THE U.S.A. ~

  • DESCRIPTION
    A hard, porous poromeric polyamide CMP (Chemical-Mechanical Planarization) pad for planarizing and polishing hard, rigid semiconductor and IC wafers, MEME and various hard material substrates, including Aluminum, Copper, ILD, Polysilicon, Silicon Oxide, and Tungsten.
  • MATERIALS OF CONSTRUCTION
    The KC-SS-OH 2020 pad consists of 2 layers.
    • 1.  A hard, porous, Polyamide TOP layer for planarization and polishing. The TOP layer is comprised of discrete repeatiing units of the same configuratiion and structural properties and a proprietary design of uniform pore size and shape distributed evenly within the layer.
    • 2.   A hard, solid, non-porous Polyamide BOTTOM layer formed in continuum with the TOP layer. The BOTTOM layer is comprised of a continuous sheet support for the TOP layer.
    • 3.   Both the TOP and BOTTOM layers are formed in one manufacturing operation.
    • 4.   A sub-pad comprised of a compressible material such as a nonwoven fabric or urethane/ PL foam may be added to the BOTTOM layer upon request.
    • 5.   All finished pads are fitted with a specialty Pressure Sensitive Adhesive (PSA) to the BOTTOM layer for adhering the pad to the polishing tool during planarization and polishing.
    • 6.   The KC-SS-OH 2020 accepts both Basic and Acidic slurries.
  • SURFACE FEATURES
    Upon request, the polishing surface of the TOP layer can be textured to a specific roughness (Ra) and may be further grooved or perforated to enhance planarization and polishing.
  • PRODUCT SIZE
    20" X 20" square or 20" diameter discs.
  • TYPICAL PHYSICAL PROPERTIES
    • Specific Gravity: ca. 0.93 g/cm3 (58lb/ ft3 EOS method)
    • Hardness: ca. 75 Durometer Shore D (ASTM D2240)
    • Compressibility: < -1.5%
    • Thickness: TOP layer ca. 70 mil. ~ BOTTOM layer ca. 50 mil.
    • Flexural Modulus: ca. 1500 MPa (EN ISO 178): 217 ksi (ASTM D790)
    • Vicat Softening Temperature B/50: ca. 163°C (EN ISO 306): 325°F (ASTM D1525)
  • CERTIFICATE OF ANALYSIS
    To be included in every production campaign lot and shipment.
  • NOTE
    The physical propertiies given above are not to be taken as part of the product specifications.