Effective lapping process is dictated by the proper lapping plates. The choice is controlled by the final objective such as: stock removal, smooth finish, the material being lapped and equally important, the diameter type/size mixed in the proper slurry.
Composite lapping plates allow for effective "charging" of the diamond in the plate. The "charged" plate can greatly enhance process time and achieve a better result, sometimes in a single step.
Composite | ยต Diamond Size Range | Slurry Base | Composite Material | Typical Usage |
---|---|---|---|---|
KFe2+O3 | 45 to 6 | Oil, Water Emulsion | Iron | Alternative to Cast Iron Aggressive Stock Removal |
KCu(OH)2 | 35 to 0.50 | Same as above | Copper | Most versatile Lap Plate Excellent for Single Step Moderate aggressive to Fine Stock Removal |
KAl2O3 | 15 to 0.50 | Same as above | Aluminum | Excellent substitute for Copper if contamination is an issue Moderate aggressive to Fine Stock Removal |
KSn2 | 2 to 0.10 | Oil Emulsion | Tin | Fine surface finish Superior flatness - can be used prior to CMP step |
KCER | 30 to 0.50 | Oil, Water Emulsion | Ceramic | Used when free metallic processing is required Moderate aggressive to fine Stock Removal |