KC PREMIER PLATES (TOOLING)

Effective lapping process is dictated by the proper lapping plates. The choice is controlled by the final objective such as: stock removal, smooth finish, the material being lapped and equally important, the diamond/ size mixed in the proper slurry.

Composite lapping plates allow for effective "charging" of the diamond into the plate. The "charged" plate can greatly enhance process time and achieve a better result, sometimes in a single step.

  • KC-PREMIER KFe2+O3
    Composite Iron - most forceful in stock removal - excellent alternative to cast iron.
  • KC-PREMIER KCu (OH)2
    Composite Copper - versatile - excellent for single step operations.
  • KC-PREMIIM KAI2O3
    Composite Aluminum - perfect alternative to the KCu (OH)2 plate if copper contamination is a problem.
  • KC-PREMIUM KSn2
    Composite Tin - tin produces a very fine finish achieving flatness. In some situations tin can minimize or replace pad polishing.
  • KC-PREMIUM KCER
    Composite Ceramic - an excellent alternative when the process requires metal free.
  • KC-PREMIUM PLATEN PATTERNS
    • Sizes - 1 inch to 100 inches OD.
    • Available mounted to a solid metal base or unmounted.
    • Groove Options - Concentric, Radial, Spiral, Square and Custom.
  • MATERIAL REMOVAL FROM HIGH TO LOW
    • Ceramic
    • Iron
    • Copper
    • Aluminum
    • Tin

Plate Groove Patterns

Plate Groove Pattern
Solid Lap
Radial Groove Pattern
Radial Groove Patterns
Waffle Groove Pattern
Waffle Groove Patterns
Concentric Groove Pattern
Concentric Groove Patterns

Plate Patterns and Suggested Usage

Composite ยต Diamond Size Range Slurry Base Composite Material Typical Usage
KFe2+O3 45 to 6 Oil, Water Emulsion Iron Alternative to Cast Iron
Aggressive Stock Removal
KCu(OH)2 35 to 0.50 Same as above Copper Most versatile Lap Plate
Excellent for Single Step
Moderate aggressive to Fine
Stock Removal
KAl2O3 15 to 0.50 Same as above Aluminum Excellent substitute for Copper if contamination is an issue
Moderate aggressive to Fine
Stock Removal
KSn2 2 to 0.10 Oil Emulsion Tin Fine surface finish
Superior flatness - can be used prior to CMP step
KCER 30 to 0.50 Oil, Water Emulsion Ceramic Used when free metallic processing is required
Moderate aggressive to fine
Stock Removal
    NOTE:
  • 1. All materials are easy contoured/ reconditioned.
  • 2. Plate material should be softer than the material being processed.
  • 3. Grooves enhance stock removal rate and surface finish in most situations.
  • 4. Water base slurries normally produce higher stock removal rates than oil base slurries, depending upon the application.