KC SYNTHETIC MONOCRYSTALLINE DIAMOND POWDER

The supplier to KellerCo Optik & Electronik is also the Sizer of the Synthetic Monocrystalline Diamonds (MCD) and is ISO90001:2000 certified. A very strict process control in their plant, guarantees consistent premium quality of the synthetic diamond powder. With MCD there are two types; resin and metal bond, indicating two kinds of hardness of the diamond along with assorted sizes including mesh sires all complying with the US Bureau of Standards.

MCD gives sharp edges ensuring clean and efficient cutting action. PCD particles are angular, blocky shaped grains providing numerous cutting faces, yielding less deformation resulting in a superior surface finish.

TECHNICAL DATA

Appearance (Dry state)

Color
Resin Bond-Grey
Metal Bond-Yellow

Chemical Composition

Carbon
Up to 99%

Physical Data

Atomic Number
12.0111
Hardness
10.000 kg/mm2
Mohs Hardness @ 20°C
10
Density
3.52 g/cm3
Oxidation temp. in open atmosphere at heating rate 50°F/min
1790°F (997°C)
Boiling point
4827°C
Thermal Conductivity
20 W/cm-K
Specific heat @ 25°C
0.165 cal/g
Thermal Expansion Coefficient
0.0000011/K
Dielectric Strength
10.000.000 V/cm
Crystallography
hexagonal
KC-MONO diagram
MONOCRYSTALLINE
KC-POLLY diagram
POLYCRYSTALLINE

STANDARD TESTING SIEVE APERTURE

Lapping and Polishing
Resin and Metal bond Diamonds are common media for lapping and polishing creating tight tolerances and high finish. Easily mixed with oil, glycol and water based vehicles.
Resinoid Bond Abrasive
Diamond Wheels
Resin bond diamonds have medium hardness and friability. Used mainly in resinoid bond abrasive wheels either wet or dry. Very forgiving material.
Metal Bond Abrasive
Diamond Wheels
Hard and tougher than resin bond. Meets the demands of hard working conditions such as grinding Ceramics, Quartz and Sapphire.
Wire Saw Slicing
Very cost effective when sawing sapphire and Silicon Carbide.

*TDS courtesy of UKA

KC SYNTHETIC POLYCRYSTALLINE DIAMOND POWDER

The Synthetic Polycrystalline Diamond (PCD) powder is produced by an explosion process that changes the composition of graphite into a diamond. The process creates a PCD which in tum consists of thousands or more crystallites bonded together.

The PCDs are unique. They are self-sharpening. A polycrystalline structure creates constantly new sharp edges by releasing the outer layer of dull micro single polycrystalline grain. These unique properties of the PCD allow faster lapping and polishing results in a smoother, scratch-free surface.

ADVANTAGES of PCD

  • High removal rates.
  • High quality finish reducing subsurface damage from micro crystals.
  • Lower diamond cost by repeatedly using the same diamonds for a wider surface finish. For example: a I 0µ diamond particle will wear down and break into smaller units decreasing in size to about Iµ allowing completion of the polishing cycle.

EXAMPLE of APPLICATIONS

  • Lapping and polishing of hard metals, their alloys, ceramics etc.
  • Sapphire polishing.
  • Gemstone polishing including diamond.
  • Lapping and polishing of ferrites, silicon and selected infrared crystals.

Appearance (Dry state)

Color
Grey

Chemical Composition

Carbon
99%
Hydrogen
< 1%
Nitrogen
< 1%
Oxygen
< 1%

Physical Data

Specific Gravity
3.451
Friability Index
75 - 80%
Structure
Polycrystalline
Decomposition
Decomposes > 500°C
Electrical Conductivity
Non-conductive
...
HSEM (High Resolution Scanning Electronic Microscope) picture of our powder size 0.05 -.2 mcm under 10,000 times magnification.
...
HSEM (High Resolution Scanning Electronic Microscope) picture of our powder size 0.05 -.2 mcm under 600,000 times magnification.

KellerCo Optik & Electronik offers a large PCD powder selection directly from the manufacture who is ISO9001:2000 certified. Turn around time is fast and reliable.

*TDS courtesy of UKA

KC-DFC (Diamond Form Casting)

WHAT IS KC-DFC? It is an extraordinary abrasive product which combines the qualities of diamonds in a thin flexible metal matrix.

  • 1. KC-DFC contains abrasive throughout its thickness and is capable of cutting on all surfaces including the edges.
  • 2. KC-DFC is MOLDED, not electroplated, therefore its cutting characteristics are comparabie to a conventional metal bonded tool.
  • 3. The manufacturing process used in making the KC-DFC results in a more homogenous, dense and completely alloyed product. The benefits are greater diamond retention, excellent uniformity and repeatability.
  • 4. KC-DFC matrix is a copper alloy with distinctive qualities of a brass sheet or foil.
  • 5. KC-DFC can be cut, punched, bent, formed, soldered, brazed and glued. The benefit is practically any metal working operation may be performed to fabricate a useful product.

KC-DFC APPLICATIONS

  • LAPPING - KC-DFC may be used on glass, ceramics, carbides and other hard materials.
  • TOOLS - KC-DFC can be cut into various shapes such as: strips, triangles, and dots and attached to metal or plastic forms to make flat or curved laps.
  • SAWING OR SLOTTING - KC-DFC can be cut into circular form, mounted between flanges resulting in a thin cut-off or sloffing saw blade. Uniform thickness and excellent diamond retention result in precision cuts.
  • CORE DRILLS - KC-DFC can be cut into strips and rolled into tubular shapes. The result is an inexpensive and highly effective ring tool or core drill.

WORKING WITH KC-DFC

  • CUTTING - Thicknesses .015" and under can be cut with scissors, over .015" requires metal cutting tools.
  • FORMING - KC-DFC can be formed easily using ordinary metal forming or hand tools. Cut sections which are distorted or have burrs can be flattened or burrs removed by pressing between flat plates. Contoured forms are done by pressing the KC-DFC between male and female forms. Forming tubular sections for core drills may be rolled on a mandrel of the correct size. Brazing the joint is recommended on larger sizes.
  • JOINING - Conventional soldering or brazing. The brazing alloy should have a flow point of 1400' or less. Loctite #324 adhesive is best.

KC-DFC MICROBLADES

Precision dicing, slotting, and cut-off applications

The KC-DFC MICROBLADES are manufactured from KC-DFC materials and have the same diamond throughout features and benefits. The KC-DFC MICROBLADES are sintered metal bond products formulated for use on glass, ceramics, and a wide variety of substrate materials. The blades can be used individually and (or) in gang arrangements.

Diamond retention, an inherent characteristic of KC-DFC, can also be found in the KC-DFC MICROBLADES. Comparing this feature to the resinoid, plated, and metal bond 1A1R blades, the benefit is improved wear rates.

IMPROVED WEAR RATES means greater tolerance control can be maintained and LESS downtime for truing, dressing, and changing blades.

DIAMOND THROUGHOUT in conjunction with interchangeable blades means that in many operations you change the flanges or spacers instead of the blade.

MULTI-LAYERS of diamond cutting surfaces are present throughout the life of the blade. The benefits include a more consistent predictable cutting rate, minimal chipping, and improved finishes.

PROFIT - Cost per cut will be less and the quality is improved.

Microblade

KC-DFC MICROBLADE specifications (Metric sizes available)

O.D. 1/2" to 4"
T .005 to .030" in increments of .001" Thickness tolerance +/- .0005"
H As required
Diamond Size Rough 80, 100   Intermediate 180, 220  Fine 320, 600  
Super Fine 15/2Omic   20/30mic   8/12mic   (finer on request)
Diamond Conc. 50 is standard - 25, 75, 100 available on request

To Order: Ex:
KC-DFC MICROBLADE 2.200" o.d. x.005" T. x.750" 15/20 micron - 50 concentration
(State tolerance desired)

KC-PC-9547 Series

  • DESCRIPTION
    The super abrasive Polycrystalline Diamond (PC) particles have unique crystal structures of multiple sharp edges. During polishing, the particles fracture into smaller sharp particles, which increase removal rate of material to create an excellent surface finish. Because the super abrasive is 100% diamond it eliminates extrinsic impurities.
  • COMPOSITION
    Water base/Glycol (W) solution
  • PARTICLE SIZE DISTRIBUTION (PSD)
    Closely spaced.
Example Particle Size Range
5µ to 7µ
1/2µ to 2µ
1/2µ 1/4µ to 1µ

Typical range of PC particles in this slurry format is from 50nm to 30µ.